{"product_id":"semiconductor-process-reliability-in-practice-9780071754279","title":"Semiconductor Process Reliability in Practice","description":"\u003cb\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.\u003c\/b\u003e\u003cbr\u003eProven processes for ensuring semiconductor device reliability\u003cp\u003eCo-written by experts in the field, \u003ci\u003eSemiconductor Process Reliability in Practice\u003c\/i\u003e contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.\u003c\/p\u003e\u003cp\u003e\u003cb\u003eCoverage includes: \u003c\/b\u003e\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eBasic device physics\u003c\/li\u003e\n\u003cli\u003eProcess flow for MOS manufacturing\u003c\/li\u003e\n\u003cli\u003eMeasurements useful for device reliability characterization\u003c\/li\u003e\n\u003cli\u003eHot carrier injection\u003c\/li\u003e\n\u003cli\u003eGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)\u003c\/li\u003e\n\u003cli\u003eNegative bias temperature instability\u003c\/li\u003e\n\u003cli\u003ePlasma-induced damage\u003c\/li\u003e\n\u003cli\u003eElectrostatic discharge protection of integrated circuits\u003c\/li\u003e\n\u003cli\u003eElectromigration\u003c\/li\u003e\n\u003cli\u003eStress migration\u003c\/li\u003e\n\u003cli\u003eIntermetal dielectric breakdown\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAbout the Author\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003eZhenghao Gan\u003c\/b\u003e is a reliability technical manager at the Semiconductor Manufacturing International Corporation (SMIC), Shanghai, China. He has extensive technical and management experience in research and development of semiconductor reliability improvement, testing\/characterization, problem solving, project management, modeling, and analysis. \u003c\/p\u003e\u003cp\u003e\u003cb\u003eWaisum Wong, Ph.D., \u003c\/b\u003e is in charge of process reliability at the Semiconductor Manufacturing International Corporation (SMIC), Shanghai, China. He has extensive experience in power device development and modeling. \u003c\/p\u003e\u003cp\u003e\u003cb\u003eJuin J. Liou, Ph.D., \u003c\/b\u003e is the Pegasus Distinguished Professor and UCF-Analog Devices Fellow in the Department of Electrical and Computer Engineering at the University of Central Florida. He has published eight books and has been awarded more than $9 million in research contracts and grants from federal agencies, state governments, and industry leaders.\u003cbr\u003e\u003c\/p\u003e","brand":"McGraw-Hill Companies","offers":[{"title":"Default Title","offer_id":50318062256402,"sku":"9780071754279","price":162.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0831\/4771\/8930\/files\/img_15569f9e-8650-46bc-b672-2626aa5f12d6.jpg?v=1727547089","url":"https:\/\/surprise-castle.myshopify.com\/products\/semiconductor-process-reliability-in-practice-9780071754279","provider":"Surprise Castle","version":"1.0","type":"link"}