{"product_id":"3d-ic-stacking-technology-9780071741958","title":"3D IC Stacking Technology","description":"Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.\u003cbr\u003eThe latest advances in three-dimensional integrated circuit stacking technology\u003cp\u003eWith a focus on industrial applications, \u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.\u003c\/p\u003e\u003cp\u003e\u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e covers: \u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eHigh density through silicon stacking (TSS) technology\u003c\/li\u003e\n\u003cli\u003ePractical design ecosystem for heterogeneous 3D IC products\u003c\/li\u003e\n\u003cli\u003eDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack\u003c\/li\u003e\n\u003cli\u003eProcess integration for TSV manufacturing\u003c\/li\u003e\n\u003cli\u003eHigh-aspect-ratio silicon etch for TSV\u003c\/li\u003e\n\u003cli\u003eDielectric deposition for TSV\u003c\/li\u003e\n\u003cli\u003eBarrier and seed deposition\u003c\/li\u003e\n\u003cli\u003eCopper electrodeposition for TSV\u003c\/li\u003e\n\u003cli\u003eChemical mechanical polishing for TSV applications\u003c\/li\u003e\n\u003cli\u003eTemporary and permanent bonding\u003c\/li\u003e\n\u003cli\u003eAssembly and test aspects of TSV technology\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAbout the Author\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003eBanqiu Wu\u003c\/b\u003e is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored\/co-authored several books, including \u003ci\u003ePhotomask Fabrication Technology\u003c\/i\u003e and \u003ci\u003eExtreme Ultraviolet Lithography\u003c\/i\u003e. He holds multiple patents and awards. \u003c\/p\u003e\u003cp\u003e\u003cb\u003eDr. Ajay Kumar\u003c\/b\u003e is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book \u003ci\u003eExtreme Ultraviolet Lithography\u003c\/i\u003e. He holds more than 100 US patents and has won many awards for innovation and commercialization. \u003c\/p\u003e\u003cp\u003e\u003cb\u003eSesh Ramaswami\u003c\/b\u003e is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40] conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.\u003cbr\u003e\u003c\/p\u003e","brand":"McGraw-Hill Companies","offers":[{"title":"Default Title","offer_id":50318061207826,"sku":"9780071741958","price":162.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0831\/4771\/8930\/files\/img_0cb8c06d-f699-460d-8ee8-1d3f7513e6d9.jpg?v=1727547006","url":"https:\/\/surprise-castle.myshopify.com\/products\/3d-ic-stacking-technology-9780071741958","provider":"Surprise Castle","version":"1.0","type":"link"}