{"product_id":"3d-ic-integration-and-packaging-9780071848060","title":"3D IC Integration and Packaging","description":"\u003cp\u003e\u003cb\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product\u003c\/b\u003e.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e\u003cbr\u003e\u003cb\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\u003cbr\u003eA comprehensive guide to 3D IC integration and packaging technology\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging\u003c\/i\u003e fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging \u003c\/i\u003ecovers: \u003cbr\u003e\u003cbr\u003e\u003cbr\u003e- 3D integration for semiconductor IC packaging\u003cbr\u003e- Through-silicon vias modeling and testing\u003cbr\u003e- Stress sensors for thin-wafer handling and strength measurement\u003cbr\u003e- Package substrate technologies\u003cbr\u003e- Microbump fabrication, assembly, and reliability\u003cbr\u003e- 3D Si integration\u003cbr\u003e- 2.5D\/3D IC integration\u003cbr\u003e- 3D IC integration with passive interposer\u003cbr\u003e- Thermal management of 2.5D\/3D IC integration\u003cbr\u003e- Embedded 3D hybrid integration\u003cbr\u003e- 3D LED and IC integration\u003cbr\u003e- 3D MEMS and IC integration\u003cbr\u003e- 3D CMOS image sensors and IC integration\u003cbr\u003e- PoP, chip-to-chip interconnects, and embedded fan-out WLP\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cb\u003eAbout the Author\u003c\/b\u003e\u003cbr\u003e\u003cp\u003e\u003cb\u003eJohn Lau, Ph.D., \u003c\/b\u003eis both an ASME and an IEEE fellow. He has written 17engineering books, published more than 425 peer-reviewed papers, and given 290lectures, workshops, and keynotes worldwide.\u003c\/p\u003e\"\u003cbr\u003e","brand":"McGraw-Hill Companies","offers":[{"title":"Default Title","offer_id":50844039348498,"sku":"9780071848060","price":215.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0831\/4771\/8930\/files\/img_bfd4e2c9-bd5f-4c02-a9b9-9049f41f9d75.jpg?v=1737308103","url":"https:\/\/surprise-castle.myshopify.com\/products\/3d-ic-integration-and-packaging-9780071848060","provider":"Surprise Castle","version":"1.0","type":"link"}